Heat-Sink Modules: Performance Enhancement for VCSEL Chips

After processing, the semiconductor material is cleaved into comparatively small pieces of 1.2mm by 1.4mm. These laser chips contain the important sorting cell as well as two neighboring cells to enable an easier handling of the chip and thus a protection of the lasers. However, due to the small dimensions of the laser chip, there was poor heat dissipation and consequently elevated temperatures in the semiconductor material. This led to limited output powers and an earlier thermal rollover. The trapping performance of the laser source is thus drastically degraded by these factors. For those reasons, it seemed necessary to incorporate a heat sink into the setup.